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High Precision Wafer Grinding Machine Quantitative Grinding Metallographic sample Polishing Machine

This machine grinding and polishing accuracy can reach to um level, high precision;
It capable of performing precise grinding and polishing of various materials (integrated circuits, semiconductor wafers, optical components, etc.
Full touch screen interface, easy to set grinding and polishing parameters
Availability:
  • GP-300P

  • EBP INSTRUMENTS

  • Shanghai, China

  • 100 Sets Per Month

  • T/T in advance

  • 1 set


Features:

1. This product is used for precision grinding and polishing with high removal accuracy;

2. The sample is vacuum adsorbed, and the sample plate can be used for grinding and polishing 4-inch (GP-400P: 6-inch) wafers;

3. The sample tilt angle can be adjusted;

4. The sample is gravity-pressurized, and the loading force is continuously adjustable;

5. The sample swings left and right to achieve semi-automatic grinding and polishing;

6. The swing speed of the swing arm is even and adjustable;

7. The swing range of the swing arm is adjustable from 0 to 15 degrees;

8. Adopt independent 1KW high -power motor with large torque. No matter the speed is fast or slow, the torque is large and constant.

9. The grinding and polishing disc has a wide range of speeds, from 5 rpm to 100 rpm ;

10. Full touch screen interface, easy to set grinding and polishing parameters;

11. All grinding and polishing parameters such as rotation speed, grinding and polishing time, rotation direction, etc. are automatically saved and easily called up;

12. Connect and control the droppers of four stations with different abrasives.


Technical Parameters:

Name

Specification

Model

GP-300P

GP-400P

Number of grinding and polishing heads

1

2

Sample diameter

3’’ (option: 4 inch), can be used for grinding and polishing 3’’ (option: 4 inch) wafers

5’’ (option: 6 inch), can be used for grinding and polishing 5’’ (option: 6 inch) wafers

Polishing resolution

1 micron (1um)

Sample tilt angle

0-10 degrees adjustable

Sample loading force

Continuously adjustable from 0-4 kg

Sample swing speed

Adjustable

Swing range of arm

0-15 degrees adjustable

Plates diameter ( mm)

φ300

φ400

Motor power

1Kw

Speed (r/min)

5 -100rpm

Rotation direction

Counterclockwise / clockwise optional, automatic switching between forward and reverse

Four-speed manual (r/min)

V1=5, V2=15, V3=25, V4=50 (user-customizable speed)

Automatic grinding and polishing parameters

64 types ( parameters include: speed, time and grinding disc rotation direction )

Grinding and polishing parameters

Users can set and call

Number of dropper units (optional)

Unit 4

Dripping speed

1-100 ml/min

power supply

Voltage: AC220V, Frequency: 50HZ

Overall dimensions ( mm )

760 x 4 30 x 3 60 (length*width*height)

weight

30 kg


Packing List:

S/N

Part name

Quantity

Part name

Quantity

1

GP-300P Precision Grinding and Polishing Compound

1 unit

Vacuum Pump

1 unit

2

Precision grinding jig

1 set

Dropper (option)

1 unit

3

Gas washing bottle (including connecting pipe)

1 set

Adhesive flocked polishing cloth 300mm

10 pcs

4

Adhesive sandpaper 300mm 180#

10 pcs

Adhesive canvas polishing cloth 300mm

10 pcs

5

Adhesive sandpaper 300mm 320#

10 pcs

Diamond suspension polishing liquid 1, 3,6 micron, 200 ml

1 bottle each

6

Sandpaper with adhesive backing 300mm 600#

10 pcs

Anti-stick disc 300mm

1

7

Sandpaper with adhesive backing 300mm 1000#

10 pcs

Magnetic plate 300mm

1

8

Adhesive sandpaper 300mm 2000#

10 pcs



9

Anti-stick disc pry bar (used for placing and prying the anti-stick disc)

1




Technical documents: 1 copy each of product instruction manual, product certificate and warranty card


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No. 56, Danshan Industrial Zone, Wenling City, China 317523
  Phone
0576-86011208 / 13524552810
  E-mail
sales@hiebp.com
All employees of EBP strives for development by quality and survival by service. We sincerely look forward to establishing a good and long-term cooperative relationship with you.

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